Physical Vapor Deposition (PVD) Equipment

Magnetron sputtering technology is a type of PVD (Physical Vapor Deposition) technology and one of the important methods for preparing thin-film materials. It leverages the characteristic that charged particles possess a certain level of kinetic energy after being accelerated in an electric field: ions are directed to a target electrode (cathode) made of the material to be sputtered, and the target atoms are sputtered out, moving in a specific direction toward the substrate and depositing onto it to form a thin film. Magnetron sputtering equipment enables controllable coating thickness and uniformity, and the prepared thin films feature high compactness, strong adhesion, and high purity. This technology has become an important means for fabricating various functional thin films.