Plasma Etching Equipment

Plasma dry etching technology is a thin-film microfabrication technique that utilizes plasma for processing. Thanks to its excellent anisotropy and process controllability, it has been widely applied in the manufacturing of basic semiconductor products.

By virtue of its accumulation and innovation in plasma control, reaction chamber design, etching process technology, and software technology,

provides advanced equipment and process solutions for fields including integrated circuits, power semiconductors, compound semiconductors, semiconductor lighting, micro-electro-mechanical systems (MEMS), and advanced packaging. Naura has now achieved full coverage of etching processes and possesses etching capabilities for a variety of materials such as silicon, deep silicon, metals, dielectrics, and compound semiconductors (including SiC, GaN, GaAs, InP, LiNbO₃, LiTaO₃, etc.). It has become the preferred choice of customers due to its superior process performance.