DIP-View

DipView D-Surface View is intended to help manufacturers of wafers up to 300-mm diameter reduce costs and chipmakers to improve yields for devices made with finest process technology. The equipment can be used for wafer surface quality control, it qualifies surface roughness, shape, flatness and topography in one single measurement of a bare or processed wafer. Its very high resolution performances bring fast, reliable and highly sensitive solution particularly adapted to off-line or in-line, surface local / global inspections in multiple industries.