The dicing machine is the third-generation laser dicing machine independently designed and developed by our company. It is mainly applied to the dicing and grooving of monocrystalline silicon, polycrystalline silicon cells and silicon wafers in the solar energy industry; as well as the dicing and cutting of semiconductor substrate materials such as silicon, germanium and gallium arsenide in the electronics industry. This equipment is carefully designed by experts. Compared with traditional YAG dicing machines, the fiber laser adopted in this machine has the following advantages: better beam quality, higher speed, lower energy consumption, maintenance-free operation and smaller size. Owing to the adoption of an automatic control system in the whole unit, its simple operation and low maintenance requirement contribute to higher production efficiency of this model.

隔膜真空泵 1、无需任何工作介质(无油)，不产生污染，同时本机气体交换仓内置有过滤材料，从而保证了空气的纯净 2、生产过程中采用新技术和新材料。它移动方便，工作流畅，从而保证了理想的真空度和较高的空气流速 3、专用电机已通过欧盟CE认证，由专业电机制造商ODM提供，合理的转动设计，装有温度保护器，在泵体温度达到130℃后自动断电，长期运转情况下保护电机不受损坏。

TLM-SCAN+ Contact resistivity and more This compact instrument measures contact resistivity, finger line resistance, finger width, and finger height of a finished solar cell or on test structures. Motorized in all axes it is capable of creating maps of all these methods by pushing a single button. Four point probe heads for measuring the sheet resistance of thin diffused layers and resistivity of wafers make the TLM-SCAN+ a low-cost yet fast and high-quality four-point-probe mapper.