Full-Automatic Laser Dicing Machine

The dicing machine is the third-generation laser dicing machine independently designed and developed by our company. It is mainly applied to the dicing and grooving of monocrystalline silicon, polycrystalline silicon cells and silicon wafers in the solar energy industry; as well as the dicing and cutting of semiconductor substrate materials such as silicon, germanium and gallium arsenide in the electronics industry. This equipment is carefully designed by experts. Compared with traditional YAG dicing machines, the fiber laser adopted in this machine has the following advantages: better beam quality, higher speed, lower energy consumption, maintenance-free operation and smaller size. Owing to the adoption of an automatic control system in the whole unit, its simple operation and low maintenance requirement contribute to higher production efficiency of this model.