D-Surface ViewDipView D-Surface View is intended to help manufacturers of wafers up to 300-mm diameter reduce costs and chipmakers to improve yields for devices made with finest process technology. The equipment can be used for wafer surface quality control, it qualifies surface roughness, shape, flatness and topography in one single measurement of a bare or processed wafer. Its very high resolution performances bring fast, reliable and highly sensitive solution particularly adapted to off-line or in-line, surface local / global inspections in multiple industries.Manufacturer: DIP-View 0.000 (CNY) Qty: Add to cart Custom wishlist OKAdd to wishlistAdd to compare listEmail a friendWarpage measurementD-Surface View provides a FULL SURFACE warpage measurement in one single acquisition. Users can extract critical parameters such as Bow, Warp, TTv, LTv in a few seconds.> 2D and 3D step heights with cursors and histography analysis> 2D profles and 3D views of the measurements> 2D and 3D roughness and waviness analysis> 2D and 3D fltering and leveling techniques> Thin flm stress and sample bow calculation
